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| AH1-1 Product Features * * * * * * The Communications Edge TM Product Information High Dynamic Range Amplifier Product Description The AH1-1 is a high dynamic range amplifier in a low-cost surface-mount package. The combination of low noise figure and high output IP3 at the same bias point makes it ideal for receiver and transmitter applications. The AH1-1 is a specially screened version of the AH1 offering a very narrow gain spread from device to device. The device combines dependable performance with superb quality to maintain MTTF values exceeding 100 years at mounting temperatures of +85C. The AH1-1 is available in both the standard SOT-89 package and the environmentally-friendly lead-free/green/RoHS-compliant SOT-89 package. The broadband amplifier uses a high reliability GaAs MMIC technology and is targeted for applications where high linearity is required. It is well suited for various current and next generation wireless technologies such as GPRS, GSM, CDMA, and W-CDMA. In addition, the AH1-1 will work for other applications within the 250 to 3000 MHz frequency range such as fixed wireless. Functional Diagram GND 4 250 - 3000 MHz +41 dBm OIP3 2.7 dB Noise Figure 13.5 dB Gain +21 dBm P1dB Lead-free/Green/RoHS-compliant SOT-89 Package * Single +5 V Supply * MTTF > 100 years 1 RF IN 2 GND 3 RF OUT Applications * * * * * * Mobile Infrastructure CATV / DBS W-LAN / ISM RFID Defense / Homeland Security Fixed Wireless Function Input Output/Bias Ground Pin No. 1 3 2, 4 Specifications (1) Parameter Operational Bandwidth Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 (2) Noise Figure (3) Operating Current Range Supply Voltage Typical Performance (4) Units MHz MHz dB dB dB dBm dBm dB mA V Min 250 12.9 Typ 800 13.3 8 15 +21 +41 2.7 150 5 Max 3000 13.8 Parameter Frequency S21 S11 S22 Output P1dB Output IP3 (2) IS-95 Channel Power (5) Noise Figure Supply Voltage Device Current Units MHz dB dB dB dBm dBm dB dB V mA 900 14.2 -21 -14 +21.7 +42 +15.5 2.2 Typical 1900 12.2 -14 -13 +22 +41 +16.5 2.9 5 150 2140 12.0 -21 -11 +22 +40 2.9 +37 120 180 1. Test conditions unless otherwise noted: T = 25 C, 50 system. 2. 3OIP measured with two tones at an output power of +5 dBm/tone separated by 10 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. Noise figure can be optimized by matching the input for optimal return loss. 4. Parameters reflect performance in an AH1-PCB application circuit, as shown on page 3. 5. Measured with -45 dBc ACPR, IS-95 9 channels fwd. Absolute Maximum Rating Parameter Operating Case Temperature Storage Temperature Supply Voltage RF Input Power (continuous) Junction Temperature -40 to +85 C -55 to +150 C +6 V +10 dBm +220 C Ordering Information Part No. AH1-1 AH1-1G AH1-PCB Rating Description High Dynamic Range Amplifier (leaded SOT-89 Pkg) High Dynamic Range Amplifier (lead-free/green/RoHS-compliant SOT-89 Pkg) 0.8 - 2.5 GHz Fully Assembled Application Circuit Specifications and information are subject to change without notice. Operation of this device above any of these parameters may cause permanent damage. WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com September 2004 AH1-1 Gain vs. Output Power The Communications Edge TM Product Information High Dynamic Range Amplifier Typical Device Data S-Parameters (VDS = +5 V, IDS = 150 mA, T = 25C, unmatched device in a 50 ohm system) Input return loss can be improved with the appropriate input matching network shown later in this datasheet. Output IP3 vs. Output Power 14 13 12 11 10 9 0 5 10 Output Power (dBm) Gain vs. Frequency 100% Idss 75% Idss 50% Idss 45 40 35 30 100% Idss 900 MHz OIP3 Load Pull Circles 900 MHz IP3=35 IP3=36 IP3=37 IP3=38 IP3=39 IP3=41 25 20 75% Idss 50% Idss 15 20 0 5 10 Output Power (dBm) 15 20 VSWR=1.5 VSWR=2 VSWR=3 VSWR=4 VSWR=5 Return Loss vs. Frequency 20 15 0 -5 -10 w/o Matching Circuitry 10 5 -15 -20 -25 S11 S22 0 0 500 1000 1500 2000 2500 3000 Frequency (MHz) ACPR vs. Channel Power -30 0 500 1000 1500 2000 2500 3000 Frequency (MHz) ACPR vs. Channel Power -40 IS-95, 9 Ch. Fwd, 885 kHz offset, 30 kHz Meas BW, 1900 MHz -40 IS-95, 9 Ch. Fwd, 885 kHz offset, 30 kHz Meas BW, 900 MHz -50 -50 -60 -60 -70 10 11 12 13 14 15 16 17 Output Channel Power (dBm) -70 10 11 12 13 14 15 16 17 Output Channel Power (dBm) S-Parameters (VD = +5 V, ID = 150 mA, T = 25C, calibrated to device leads) Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) 50 250 500 750 1000 1250 1500 1750 2000 2250 2500 2750 3000 -2.24 -4.76 -7.30 -8.66 -8.70 -8.32 -7.78 -7.32 -6.82 -6.46 -6.24 -5.74 -5.25 -0.36 -0.36 -0.30 -0.30 -0.34 -0.38 -0.41 -0.41 -0.40 -0.37 -0.32 -0.26 -0.19 17.17 15.74 14.67 14.11 13.83 13.62 13.36 13.03 12.80 12.52 12.14 11.81 11.45 164.69 161.34 160.30 154.63 146.75 138.48 129.80 121.57 113.51 104.74 96.55 88.90 81.33 -23.16 -20.54 -19.45 -19.15 -19.05 -18.99 -18.99 -18.96 -18.87 -18.89 -18.93 -18.93 -18.92 50.85 31.24 14.79 3.75 -1.71 -5.88 -9.79 -12.84 -16.17 -19.71 -23.30 -26.26 -29.49 -5.86 -8.86 -13.03 -16.72 -18.22 -19.16 -20.14 -20.93 -21.11 -21.15 -21.55 -22.52 -24.14 -33.21 -47.02 -52.43 -49.89 -48.40 -52.48 -59.84 -68.57 -76.23 -83.31 -90.61 -94.38 -104.23 Specifications and information are subject to change without notice. WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com September 2004 AH1-1 Frequency S21 - Gain S11 - Input R.L. S22 - Output R.L. Output P1dB Output IP3 (+5 dBm / tone, 10 MHz spacing) The Communications Edge TM Product Information High Dynamic Range Amplifier Application Circuit: 800 - 2500 MHz (AH1-PCB) Vcc = +5 V Typical RF Performance at 25C Units 900 1900 2140 dB 14.2 12.2 12.0 dB -21 -14 -21 dB -14 -13 -11 dB +21.7 +22 +22 dB dB dB +42 +41 +40 All passive components are of size 0603 unless otherwise noted. Component C1 is shown in the silkscreen but is not used for this configuration. Z0=22 Ohm EL=15.2 Deg F0=0.9 GHz ID=Q1 NET="AH1" ID=C5 C=56 pF ID=C2 C=56 pF ID=C4 L=12 nH IS-95 Channel Power (@-45 dBc ACPR, 9 channels fwd) +15.5 +16.5 2.2 2.9 2.9 +5V @ 150mA ID=C3 L=5.6 nH ID=C6 C=56 pF Noise Figure Device Bias Gain Return Loss 15 14 13 12 11 10 750 1000 1250 1500 1750 2000 2250 Frequency (MHz) 0 -5 -10 -15 -20 -25 -30 750 1000 1250 1500 S11 S22 1750 2000 2250 Circuit Board Material: .062" total thickness with a .014" FR-4 top RF layer, 4 layers (other layers added for rigidity), 1 oz copper, 50 Microstrip line details: width = .025". Frequency (MHz) Specifications and information are subject to change without notice. WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com September 2004 AH1-1 The Communications Edge TM Product Information High Dynamic Range Amplifier AH1-1 (SOT-89 Package) Mechanical Information This package may contain lead-bearing materials. The plating material on the leads is SnPb. Outline Drawing Product Marking The AH1-1 will be marked with an "AH1" designator. An alphanumeric lot code ("XXXX-X") is also marked below the part designator on the top surface of the package. A "1" will be lasermarked in the upper righthand corner. Tape and reel specifications for this part are located on the website in the "Application Notes" section. MSL / ESD Rating ESD Rating: Value: Test: Standard: ESD Rating: Value: Test: Standard: Class 1B Passes 500V to <1000V Human Body Model (HBM) JEDEC Standard JESD22-A114 Class IV Passes 1000V to <2000V Charged Device Model (CDM) JEDEC Standard JESD22-C101 Land Pattern MSL Rating: Level 3 at +235 C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135") diameter drill and have a final plated thru diameter of .25 mm (.010"). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Thermal Specifications Parameter Operating Case Temperature Thermal Resistance, Rth (1) Junction Temperature, Tjc (2) MTTF vs. GND Tab Temperature 1000 -40 to +85C 59 C / W 129 C M T T F (m illio n h rs ) Rating 100 10 1. The thermal resistance is referenced from the hottest part of the junction to the ground tab (pin 4). 2. This corresponds to the typical biasing condition of +5V, 150 mA at an 85C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 160 C. 1 60 70 80 90 100 Tab Temperature (C) 110 Specifications and information are subject to change without notice. WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com September 2004 AH1-1 The Communications Edge TM Product Information High Dynamic Range Amplifier AH1-1G (Green / Lead-free SOT-89 Package) Mechanical Information This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260C reflow temperature) and leaded (maximum 245C reflow temperature) soldering processes. The plating material on the leads is NiPdAu. Outline Drawing Product Marking The AH1-1G will be marked with "AH1G" designator. An alphanumeric code ("XXXX-X") is also marked below part designator on the top surface of package. A "1" will be lasermarked in upper right-hand corner. an lot the the the Tape and reel specifications for this part are located on the website in the "Application Notes" section. MSL / ESD Rating Land Pattern ESD Rating: Value: Test: Standard: ESD Rating: Value: Test: Standard: Class 1B Passes 500V to <1000V Human Body Model (HBM) JEDEC Standard JESD22-A114 Class IV Passes 1000V to <2000V Charged Device Model (CDM) JEDEC Standard JESD22-C101 MSL Rating: Level 3 at +260 C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135") diameter drill and have a final plated thru diameter of .25 mm (.010"). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Thermal Specifications Parameter Operating Case Temperature Thermal Resistance, Rth (1) Junction Temperature, Tjc (2) MTTF vs. GND Tab Temperature 1000 -40 to +85C 59 C / W 129 C M T T F (m illio n h rs ) Rating 100 10 1. The thermal resistance is referenced from the hottest part of the junction to the ground tab (pin 4). 2. This corresponds to the typical biasing condition of +5V, 150 mA at an 85C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 160 C. 1 60 70 80 90 100 Tab Temperature (C) 110 Specifications and information are subject to change without notice. WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com September 2004 |
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